Qualification type: PhD
Location: Sydney, New South Wales, Australia
Funding for: UK Students, EU Students, International Students
Funding amount: AUD$40,000 per annum + support package of up to ... More...
Lead and develop an engineering team to offer state-of-the art knowledge to the IC packaging development projects
Define wafer saw, die attach and wire bond unit process developm ... More...
Process startup and qualification to support equipment installation.
Process optimization and yield improvement.
Support design of experiment.
Review data and results and impleme ... More...